Ir-Mn features outstanding non-volatility and unlimited rewrite cycles, widely adopted as antiferromagnetic layer material for non-volatile magnetic memory (MRAM). We have established a melting target production process to achieve ultra-low oxygen content.
<Compared with conventional sintered targets, our melted targets effectively prevent oxygen contamination to adjacent functional layers.
Gas Impurity Content
O ＜ 150ppm, N ＜ 150ppm
Purity Grade
≥99.9% (Fe＜30ppm, Si＜30ppm, Cu＜20ppm)
Backing Plate Fabrication
With years of accumulated technology in sputtering targets and target bonding, we can customize backing plates to meet all customer requirements. Our backing plates (substrates for target bonding) are strictly selected from oxygen-free copper, various copper alloys, iron, stainless steel, aluminum, aluminum alloy, molybdenum, titanium and other materials according to customer applications. We also optimize material combinations and provide improvement suggestions for better user experience.
Available Production Sizes
We produce backing plates ranging from small lab-sized pieces with ~1mm diameter to ultra-large panels over 2 meters for 7th-generation LCD lines. Custom shapes including circular, rectangular and special irregular profiles are available. We accept minimum order of 1 piece.
For internal water-cooled backing plates, multiple welding technologies such as brazing, electron beam welding and diffusion welding are adopted based on production process demands.
Please contact our sales team for inquiries about materials, shapes and process optimization.
For first-time customized orders, kindly provide drawings or physical samples; we can conduct measurement and produce engineering drawings accordingly.
