TSV (Through-Silicon Via) technology is an innovative interconnection solution for stacked chips in 3D integrated circuits. TSV enables maximum density of 3D chip stacking, shortest interconnection lines and minimal component footprint, while greatly improving chip speed and low-power performance. Meiming Electronics masters the latest TSV technology and can fulfill customized TSV requirements for clients.
Process Introduction
TSV (Through-Silicon Via) technology is an innovative interconnection solution for stacked chips in 3D integrated circuits. TSV enables maximum density of 3D chip stacking, shortest interconnection lines and minimal component footprint, while greatly improving chip speed and low-power performance. Meiming Electronics masters the latest TSV technology and can fulfill customized TSV requirements for clients.
Technical Applications
As one of the most promising microelectronic manufacturing technologies, TSV is widely applied in MEMS devices, memory chips, image sensors, power amplifiers, biomedical equipment and various mobile phone ICs.
Process Capacity
Via diameter: 20–30um
Aspect ratio: 10:1
Via filling materials: Copper, Gold
Via types: Solid via, hollow via
